RESIN COMPOSITION FOR INSULATING MATERIALS, INSULATING INK, INSULATING FILM AND ORGANIC FIELD EFFECT TRANSISTOR USING INSULATING FILM

• Main Authors: OKAMOTO TOMOKO, MINAKUCHI RYO, SAKURAI YOSHINOBU
• Format: Patent
• Language: English; Korean
• Published: 21.10.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

유기 전계 효과 트랜지스터의 성능을 향상시키기 위해서, 고도의 절연 파괴 강도와 리크 전류 밀도의 낮음을 겸비하면서, 인쇄법에 적합한 빠른 경화 속도와 내용제성을 겸비한 절연 재료 및 당해 절연 재료를 갖는 절연막 및 트랜지스터를 제공한다. 비닐계 중합체를 함유하는 절연 재료용 수지 조성물로서, 당해 비닐계 중합체의 산가가 20㎎KOH/g 이하이며, 또한, (메타)아크릴로일기 당량이 220∼1600g/eq이며, 당해 비닐계 중합체가 페닐기와 (메타)아크릴로일기를 갖는다. The present invention provides an insulating material which has a high curing rate as well as solvent resistance suitable for a printing method while having a high degree of breakdown strength as well as a low leak current density in order to improve the performance of an organic field effect transistor, and also provides an insulating film having the insulating material and a transistor. A resin composition for insulating materials contains a vinyl polymer, and the vinyl polymer has an acid value of 20 mgKOH/g or less, a (meth)acryloyl group equivalent of 220 to 1600 g/eq, and phenyl groups and (meth)acryloyl groups.