FILLING METHOD AND FILLING APPARATUS OF CONDUCTIVE MATERIALS

• Main Authors: GOUKO NORIO, OKAMOTO KEIJI, SAKAIDA ATUSI, ISHIKAWA TOMIKAZU
• Format: Patent
• Language: English; Korean
• Published: 23.03.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

(Purpose) To improve a filling ratio of metal powders included in a through via formed in a sheet material. (Constitution) A plurality of through vias (11) are formed on a sheet material. Then, while an upper mask (200) having a through hole (203) formed to communicate with the through via (11) is arranged at one side (10a) of the sheet material (10), a solvent absorption sheet (180) for absorbing a solvent and a lower mask (170) having a through hole (173), which is formed at a portion corresponding to the through hole (203) formed on the upper mask (200), are sequentially arranged at the other side (10b) opposite to the one side (10a) of the sheet material (10). Then, the lower mask (170), the solvent absorption sheet (180), the sheet material (10), and the upper mask (200) are mechanically fixed. Also, while absorbing in an inner portion of the through via (11) through the through hole (173) formed on the lower mask (170) at the other side (10b) of the sheet material (10), a conductive material (2) is filled in the through via (11) through the through hole (203) formed on the upper mask (200) at the one side (10a) of the sheet material (10).