INDUCTIVE INERTIAL SENSOR ARCHITECTURE & FABRICATION IN PACKAGING BUILD-UP LAYERS

• Main Authors: MA QING, LIN KEVIN L, SWAN JOHANNA M, TEH WENG HONG, RAO VALLURI R, EID FERAS
• Format: Patent
• Language: English; Korean
• Published: 04.08.2014
• Subjects: GYROSCOPIC INSTRUMENTS; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT; MEASURING; MEASURING DISTANCES, LEVELS OR BEARINGS; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK; NAVIGATION; PHOTOGRAMMETRY OR VIDEOGRAMMETRY; PHYSICS; SURVEYING; TESTING

This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.