STRIPPER COMPOSITION FOR THICK NEGATIVE PHOTORESIST

The present invention relates to a stripper composition for photoresist removal. The composite according to the present invention comprises 1-5 wt% of a compound represented by chemical formula (1), 70-95 wt% of a polar organic solvent, 0.1-5 wt% of a hydroxide-based compound and a rest amount of wa...

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Bibliographic Details
Main Authors PARK, YOUNG JIN, KANG, YOUNG HAN, LEE, SANG DAI, RYU, HYUN KYU
Format Patent
LanguageEnglish
Korean
Published 10.03.2014
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:The present invention relates to a stripper composition for photoresist removal. The composite according to the present invention comprises 1-5 wt% of a compound represented by chemical formula (1), 70-95 wt% of a polar organic solvent, 0.1-5 wt% of a hydroxide-based compound and a rest amount of water. The stripper composition according to the present invention is able to effectively complete a stripping process within a short time by including the proper amount of the compound represented by chemical formula (1) without an anticorrosive agent and is able to minimize composition variation in a stripping process performed at relatively high process temperatures as compared to a different process. The stripper composition is able to prevent post-processing defect such as evaporation defect due to the adsorption of non-aqueous anticorrosive agents by excluding anticorrosive agents while preventing electrode damage.
Bibliography:Application Number: KR20120096430