POLYMERS WITH METAL FILLER FOR EMI SHIELDING
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Main Authors | , , |
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Format | Patent |
Language | English Korean |
Published |
07.10.2013
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Subjects | |
Online Access | Get full text |
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Author | LENHERT JON M SOUSA JOSE R CHUNG CHAN S |
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Author_xml | – fullname: SOUSA JOSE R – fullname: LENHERT JON M – fullname: CHUNG CHAN S |
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RelatedCompanies | SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION |
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SubjectTerms | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
Title | POLYMERS WITH METAL FILLER FOR EMI SHIELDING |
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