THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

• Main Authors: JO, YUN KYOUNG, EOM, SAI RAN, PARK, CHANG HWA, LIM, SEOL HEE, KIM, AE RIM
• Format: Patent
• Language: English; Korean
• Published: 18.06.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PURPOSE: A printed circuit board and a method of manufacturing the same are provided to perform a surface treatment without using gold, offer a surface treating structure capable of increasing the binding force to a copper bonding wire, thereby reducing the costs incurred during the surface treatment and an assembling step. CONSTITUTION: A printed circuit board(100) comprises an insulation plate(110), a circuit pattern or base pattern(120), and a protection layer(170). A nickel-metal layer(130), a first palladium-metal layer(140), a silver-metal layer(150), and a second palladium-metal layer(160) are successively formed on the circuit pattern or base pattern. The insulation plate has a role of a supporting plate in which a single circuit pattern is formed, and a plurality of circuit patterns or base pads(12) are formed thereon. A plurality of circuit patterns or base pads is formed with a conductive material, by patterning simultaneously a copper foil layer on the insulation plate. The nickel-metal layer is formed on the top surface of the circuit patterns or the base pads. The first palladium-metal layer is formed with a plating solution including palladium. The silver-metal layer is formed to be bonded to a copper wire, and replaces a gold-metal layer. The second palladium-metal layer is formed to prevent the displacement of the silver-metal layer.