THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase production efficiency by manufacturing multiple printed circuit boards at a time. CONSTITUTION: A via(121a,161a) passes through a core insulating layer(150,170). A first width(d1) and a second width(d2) of t...

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Bibliographic Details
Main Authors YOO, CHANG WOO, CHUN, KI DO, YOON, SUNG WOON, LEE, SANG MYUNG, LEE, SUNG WON
Format Patent
LanguageEnglish
Korean
Published 07.02.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase production efficiency by manufacturing multiple printed circuit boards at a time. CONSTITUTION: A via(121a,161a) passes through a core insulating layer(150,170). A first width(d1) and a second width(d2) of the via is about 20μm to 100μm. An internal circuit layer(146) is buried in the core insulating layer. An external circuit layer(122,162) is formed in the upper or the lower part of the core insulating layer. A protection layer(180) protects the external circuit layer and the surface of the core insulating layer.
Bibliography:Application Number: KR20110076278