SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to minimize a loss between an antenna part and a semiconductor chip by minimizing an electric connection distance between the semiconductor chip and the antenna part. CONSTITUTION: An encapsulating unit(20) encapsulates...

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Bibliographic Details
Main Authors HAN, MYEONG WOO, YOO, DO JAE, PARK, CHUL GYUN, YOON, JUNG HO, LEE, JUNG AUN
Format Patent
LanguageEnglish
Korean
Published 16.01.2013
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A semiconductor package and a manufacturing method thereof are provided to minimize a loss between an antenna part and a semiconductor chip by minimizing an electric connection distance between the semiconductor chip and the antenna part. CONSTITUTION: An encapsulating unit(20) encapsulates a semiconductor chip(10). A substrate part(30) is formed on one side of the encapsulating unit and includes a top substrate(30a) formed on the upper side of the encapsulating unit and a bottom substrate(30b) formed on the lower side of the encapsulating unit. An antenna part(40) is electrically connected to the semiconductor chip. A via connection part(25) passes through the encapsulating unit.
Bibliography:Application Number: KR20110067437