DEPOSITION APPARATUS

• Main Authors: DAIKU HIROYUKI, KAMIKAWA KENJI
• Format: Patent
• Language: English; Korean
• Published: 06.02.2012
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE: A deposition apparatus is provided to properly adjust the deposition speed of a deposition material by regulating a distance between a deposition speed detection element and the outlet of a detection nozzle. CONSTITUTION: A deposition apparatus comprises a dispersion container(14), material inlet pipes(18A,18B), a deposition speed detection element(33), and a deposition speed regulating unit(34). Multiple deposition nozzles are formed inside the dispersion container. The material inlet pipes are connected to the dispersion container and have control valves. A detection nozzle penetrates through the dispersion container. The deposition speed detection element detects the deposition speed of a deposition material emitted from the detection nozzle. The deposition speed regulating unit regulates a gap between the deposition speed detection element and the outlet of the detection nozzle.