PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

• Main Authors: KANG, MYUNG SAM, CHO, MIN JUNG, HWANG, MI SUN, KANG, SEON HA, YUN, KIL YONG, SHIN, GIL YONG, KIM, OK TAE
• Format: Patent
• Language: English; Korean
• Published: 23.03.2011
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent a defect due to twist in a hole forming process by including an expansion and contraction preventing unit to prevent the expansion and contraction of an insulation layer and an electrode pattern. CONSTITUTION: A printed circuit board includes a substrate, an electrode pattern(120), and an expansion and contraction preventing unit. A plurality of insulation layers are laminated on the substrate. The electrode pattern is formed on one side of the substrate. The insulation layers are bonded with each other through heat. The expansion and contraction preventing unit prevent the expansion and contraction of the insulation layer and the electrode pattern. The expansion and contraction preventing unit is formed on a dummy part of the substrate. The substrate includes insulation layers which are laminated with four layers. A copper layer(122) is formed on both sides of the substrate.