METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING

PURPOSE: A packaging method of circuit chip and a package thereof are provided to improve the quality of the main thermal dissipation route ranging from a chip package module to the outside of the package by comprising the capability to dissipate the heat. CONSTITUTION: A substrate(110) having the f...

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Bibliographic Details
Main Authors IRUVANTI SUSHUMNA, MARTIN YVES C, KESSEL THEODORE VAN, WEI XIAOJIN
Format Patent
LanguageEnglish
Korean
Published 21.02.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A packaging method of circuit chip and a package thereof are provided to improve the quality of the main thermal dissipation route ranging from a chip package module to the outside of the package by comprising the capability to dissipate the heat. CONSTITUTION: A substrate(110) having the first thermal coefficient of expansion is prepared. A circuit chip(120) having the second coefficient of thermal expansion is mounted on the top of the substrate. A metal foil(140) is arranged on the circuit chip in order to form the thermal contact with the circuit chip. The adhesive(150) is spread on a metal lid(130) having the third coefficient of thermal expansion.
Bibliography:Application Number: KR20100071094