A SOLAR CELL AND FABRICATION METHOD USING CRYSTALLINE SILICON BASED ON LOWER GRADE FEEDSTOCK MATERIALS

Formation of a solar cell device from upgraded metallurgical grade silicon which has received at least one defect engineering process and including a low contact resistance electrical path. An anti-reflective coating is formed on an emitter layer and back contacts are formed on a back surface of the...

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Main Authors RAKOTONIAINA JEAN PATRICE, BLOSSE ALAIN, KIRSCHT FRITZ, KAES MARTIN, OUNADJELA KAMEL, ZERGA ABDELLATIF, HEUER MATTHIAS, ZICKERMANN DIRK
Format Patent
LanguageEnglish
Korean
Published 21.12.2010
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Abstract Formation of a solar cell device from upgraded metallurgical grade silicon which has received at least one defect engineering process and including a low contact resistance electrical path. An anti-reflective coating is formed on an emitter layer and back contacts are formed on a back surface of the bulk silicon substrate. This photovoltaic device may be fired to form a back surface field at a temperature sufficiently low to avoid reversal of previous defect engineering processes. The process further forms openings in the anti-reflective coating and a low contact resistance metal layer, such as nickel layer, over the openings in the anti-reflective coating. The process may anneal the low contact resistance metal layer to form n-doped portion and complete an electrically conduct path to the n-doped layer. This low temperature metallization (e.g., <700° C.) supports the use of UMG silicon for the solar device formation without the risk of reversing earlier defect engineering processes.
AbstractList Formation of a solar cell device from upgraded metallurgical grade silicon which has received at least one defect engineering process and including a low contact resistance electrical path. An anti-reflective coating is formed on an emitter layer and back contacts are formed on a back surface of the bulk silicon substrate. This photovoltaic device may be fired to form a back surface field at a temperature sufficiently low to avoid reversal of previous defect engineering processes. The process further forms openings in the anti-reflective coating and a low contact resistance metal layer, such as nickel layer, over the openings in the anti-reflective coating. The process may anneal the low contact resistance metal layer to form n-doped portion and complete an electrically conduct path to the n-doped layer. This low temperature metallization (e.g., <700° C.) supports the use of UMG silicon for the solar device formation without the risk of reversing earlier defect engineering processes.
Author ZICKERMANN DIRK
KIRSCHT FRITZ
ZERGA ABDELLATIF
BLOSSE ALAIN
KAES MARTIN
RAKOTONIAINA JEAN PATRICE
OUNADJELA KAMEL
HEUER MATTHIAS
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– fullname: OUNADJELA KAMEL
– fullname: ZERGA ABDELLATIF
– fullname: HEUER MATTHIAS
– fullname: ZICKERMANN DIRK
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Snippet Formation of a solar cell device from upgraded metallurgical grade silicon which has received at least one defect engineering process and including a low...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title A SOLAR CELL AND FABRICATION METHOD USING CRYSTALLINE SILICON BASED ON LOWER GRADE FEEDSTOCK MATERIALS
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