METHOD FOR MANUFACTURING BURIED PATTERN USING SPACER PATTERING

PURPOSE: A method for manufacturing buried pattern using spacer pattering is provided to easily form a pattern having a curved structure by forming a buried pattern having pad regions which are crossed with each other. CONSTITUTION: A spacer(28) has a first sacrifice opening(29) which is defined as...

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Bibliographic Details
Main Authors KOO, SUN YOUNG, KIM, MYUNG OK
Format Patent
LanguageEnglish
Korean
Published 19.11.2010
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A method for manufacturing buried pattern using spacer pattering is provided to easily form a pattern having a curved structure by forming a buried pattern having pad regions which are crossed with each other. CONSTITUTION: A spacer(28) has a first sacrifice opening(29) which is defined as a pad region at either side on a first film. A second film pattern has a second sacrifice opening(33) which is defined at either side of a second film by etching the second film through a pad mask. The substrate is etched by using the first film as a etch barrier to form a trench. A buried pattern is buried at the trench.
Bibliography:Application Number: KR20090040735