UNDER BUMP ROUTING LAYER METHOD AND APPARATUS

Various semiconductor chip conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a semiconductor chip. The conductor structure has a first site electrically connected to a first redis...

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Main Authors LI YUE, TOPACIO RODEN, MCLELLAN NEIL, CHEUNG TERENCE
Format Patent
LanguageEnglish
Korean
Published 24.09.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract Various semiconductor chip conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a semiconductor chip. The conductor structure has a first site electrically connected to a first redistribution layer structure and a second site electrically connected to a second redistribution layer structure. A solder structure is formed on the conductor structure.
AbstractList Various semiconductor chip conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a semiconductor chip. The conductor structure has a first site electrically connected to a first redistribution layer structure and a second site electrically connected to a second redistribution layer structure. A solder structure is formed on the conductor structure.
Author TOPACIO RODEN
LI YUE
MCLELLAN NEIL
CHEUNG TERENCE
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Snippet Various semiconductor chip conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that...
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title UNDER BUMP ROUTING LAYER METHOD AND APPARATUS
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