SUBSTRATE FOR TEST OF SEMICONDUCTOR PACKAGE AND EQUIPMENT FOR TEST OF SEMICONDUCTOR DEVICE USING THE SAME

PURPOSE: A substrate for testing a semiconductor package and the test apparatus for the semiconductor package using the same are provided to reduce a time for a test process using probe tips for external connection terminals in the package in order to perform an electrical test. CONSTITUTION: A cond...

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Bibliographic Details
Main Authors SEO, HO CHUL, SONG, YOON GYU
Format Patent
LanguageEnglish
Korean
Published 28.06.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PURPOSE: A substrate for testing a semiconductor package and the test apparatus for the semiconductor package using the same are provided to reduce a time for a test process using probe tips for external connection terminals in the package in order to perform an electrical test. CONSTITUTION: A conductive plate(110) includes an upper surface and a lower surface opposing to the upper surface. A semiconductor package including external connection terminals for signaling and grounding is arranged on the upper surface. A plurality of through holes(116) is formed in the conductive plate. An insulating layer(120) is formed on the exposed upper surface due to the through holes and the lateral side of the conductive plate. A connection unit(118) for grounding which electrically connects with a measuring unit is arranged on the lower surface.
Bibliography:Application Number: KR20080129317