PROCESSING APPARATUS FOR SUBSTRATE
An apparatus for processing a substrate is provided to easily remove the first solution from the substrate without stop of the substrate, thereby improving productivity. The first transfer unit parallel transfers a substrate(1) coated by the first solution by the first nozzle(6) for the ground at he...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English Korean |
Published |
01.09.2009
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | An apparatus for processing a substrate is provided to easily remove the first solution from the substrate without stop of the substrate, thereby improving productivity. The first transfer unit parallel transfers a substrate(1) coated by the first solution by the first nozzle(6) for the ground at height of the first level in the first direction. The second transfer unit parallel transfers the substrate from which the first solution is removed. If a leading end part of the substrate reaches to a location sensor(7) between the first and second transfer units, a height control unit(5) drops a variable roller(4). The height control unit forms a solution collecting unit removing the first solution by the drop of the variable roller. If the substrate is completely transferred to the second transfer unit, the height control unit increases the variable roller. |
---|---|
Bibliography: | Application Number: KR20080017874 |