LIGHT EMITTING DIODE

• Main Authors: INOKOSHI YOSHIO, KASHITANI KOHSUKE
• Format: Patent
• Language: English
• Published: 19.06.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A light emitting diode is provided to avoid the generation of cracks in sealing resin even if thermal impact is applied, by making the front angular part of a leadframe have a curved part of an arc shape from a planar point of view. First and second leadframes(12,14) are prepared whose end portions confront each other. A light emitting device(16) is fixed to a mount stage(30) formed at the front end of the first leadframe. A bonding stage(40) formed at the front end of the second leadframe is connected to the light emitting device by a wire(18). The light emitting device, the mount stage, the bonding stage and the wire are sealed by sealing resin(22). The mount stage and the bonding stage are made of flat plate shapes wherein the front angular part of at least one state is made of a curved part(32,42) of an arc shape from a planar point of view. A reflection surface(24a) for reflecting the light emitted from the light emitting device can be formed in a reflection frame body.