PRESSURE REDUCED DRYING PROCESSING APPARATUS

• Main Authors: TAKASE SHINJI, KAJIMA ATSUO
• Format: Patent
• Language: English
• Published: 03.08.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A pressure reduced drying processing apparatus is provided to prevent interference of a robot arm in a chamber by connecting an operation of a door for opening/shutting an opening with a ceiling plate installed in the inside of the chamber. A pressure reduced drying processing apparatus is used for transferring a substrate(W) into a chamber(1) and pressing and drying a coating solution onto the substrate. A substrate gripping member is installed in the inside of the chamber. A ceiling plate(14) is arranged in the inside of the chamber to be elevated to the substrate gripping member. A plurality of openings(2,3) are formed at a side of the chamber to receive a robot arm(15). A plurality of doors(4,5) are disposed to open or shut the openings. The ceiling plate is moved upwardly according to the opening motion of the doors. The ceiling plate is moved downwardly according to the shutting motion of the doors. The ceiling plate is attached through a reinforcing plate(13) to a cylinder unit(10).