METHOD FOR PROCESSING SURFACE OF PARTS INSIDE OF CHAMBER TO PREVENT CONTAMINATION

• Main Authors: KIM, GI SEOK, HAN, O YEON, BAE, DO IN, HAN, CHEON SU, SUNG, SUN HWAN
• Format: Patent
• Language: English; Korean
• Published: 31.12.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE: A method for processing a surface of parts inside of a chamber is provided to prevent Ti from being peeled off the chamber. CONSTITUTION: A plurality of parts in an inner potion of a chamber is closed. The parts are cleaned by a cleaning solution and by performing ultra sonic cleaning in deionized water. A bead is injected to surfaces of the parts by 5 psi or more. A metallic arc is injected to surfaces of the parts. And then, the parts are cleaned, dried, and preserved.