LED LAMP AND FABRICATING METHOD THEREOF TO AVOID DELAMINATION CAUSED BY THERMAL STRESS EVEN IN HIGH TEMPERATURE TREATMENT

• Main Authors: KAMIKAWA TOSHIMI, MORI HIDEKI, TSUZUKI ATSUSHI, TSUKAMOTO HIROKO, YAMAGUCHI HISAO, HAMADA MAHITO
• Format: Patent
• Language: English; Korean
• Published: 21.10.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; LIGHTING; MECHANICAL ENGINEERING; NON-PORTABLE LIGHTING DEVICES; SEMICONDUCTOR DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS

PURPOSE: An LED(light emitting diode) lamp is provided to avoid delamination caused by thermal stress even in a high temperature treatment by including a copper-resist junction part having a plurality of micro roughnesses and a surface with good adhesion. CONSTITUTION: A substrate(2) is coated with a metal pattern formed as an electrical conduction part including a copper layer(4), a nickel layer(5) and a gold layer(6) that are sequentially and consecutively stacked. A resin frame member is fixed to the substrate through adhesive. A light emitting device is fixed to the inside of the frame of the resin frame member on the substrate to be electrically connected to the metal pattern. Resist(3) is attached to a surface of the copper layer of the metal pattern in which copper or nickel doesn't exist, so as to be partially placed between the substrate and the resin frame member. Light transmission resin is filled in the frame of the resin frame member to seal the light emitting device.