METHOD FOR MANUFACTURING MULTILAYERED CLAD PALATE INCLUDING A Cu PLATE

• Main Author: HONG, YOU PYO
• Format: Patent
• Language: English; Korean
• Published: 01.12.2003
• Edition: 7
• Subjects: LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; TRANSPORTING

PURPOSE: A method of manufacturing a multi-clad panel having at least a copper(Cu) plate is provided, which has good interlayer adhesion by preventing a surface of the Cu plate from being oxidized even if it is heated at a high temperature during pressure bonding. CONSTITUTION: The method of manufacturing a multi-clad panel having at least a Cu plate(1) comprises: sequentially applying nickel(Ni) and chromium(Cr) on both surfaces of the Cu plate(1) to form anti-oxidative layers(2-1,2-2); superposing an aluminum(Al) plate(3) and a stainless steel plate(4) on both surfaces of the Cu plate(1) having the anti-oxidative layers(2-1,2-2) and heating the resultant structure at 200-350deg.C; and pressure-bonding the superposed plates at 200-350deg.C. 본 발명은 적어도 Cu판을 포함하는, 다층의 클래드 판재를 제조하는 방법으로서: (가) Cu판의 양쪽 표면에 Ni과 Cr을 순차로 도금하여 산화방지막을 형성하는 단계; 및 (나) 산화방지막이 형성된 Cu판의 양면에 Al판과 스텐레스판을 중첩시키고 200 내지 350℃로 가열하는 단계; 및 (다) 중첩된 판을 상기 가열 온도에서 압접시키는 단계를 포함한다.