method for manufacturing of board for flooring materials
PURPOSE: A method for manufacturing of a wood board for flooring coverings is provided to reduce raw material cost and prevent deformation of the wood board due to moisture by differing manufacturing process of the wood board. CONSTITUTION: The method for manufacturing of a wood board for flooring c...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English Korean |
Published |
26.02.2003
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | PURPOSE: A method for manufacturing of a wood board for flooring coverings is provided to reduce raw material cost and prevent deformation of the wood board due to moisture by differing manufacturing process of the wood board. CONSTITUTION: The method for manufacturing of a wood board for flooring coverings comprises the steps of obtaining wood flooring by stripping off wood from the material wood using a cutting knife as rotating a cylindrical material wood so that the stripped wood has a thickness far thinner than that of a product flooring to be used; cutting the circumferential part of the wood flooring stripped off to a thin thickness using the cutting knife so that the cutting surface is in the straight line state; adhering thus connecting the contact surfaces of the wood floorings using a synthetic resin bond by horizontally contacting a plurality of wood floorings the circumferential part of which is in the straight line state so that the wood floorings are horizontally contacted to a certain size; laying up several sheets of the wood floorings so that the total thickness of the bond coated wood flooring becomes thickness of the product flooring to be used after coating a waterproofing bond onto the large sized wood floorings connected by the synthetic resin bond; obtaining a large sized wood board by integrally pressing the laid-up several sheets of wood floorings using a hot press; obtaining the body(101) of the wood board by cutting the wood board again using a cutting saw so that the wood board has length and width of the product flooring to be used; smoothing the body of the wood board by sanding the upper surface of the body of the wood board; forming a UV coating layer(102) of a certain thickness by coating a UV coating agent onto the upper surface of the sanding treated body of the wood board for several times; and forming an urethane coating layer(103) of a certain thickness by coating an urethane paint on the upper surface of the UV coating layer.
본 발명은 바닥재용 나무편의 제조방법에 관한 것으로, 원통형상의 원목을 회전시키면서 절단칼에 의해 얇은 두께로 벗겨낸 다음 이를 넓게 연결시킴과 동시에 여러장을 적층상태로 접착제에 의해 접착시켜 원하는 두께가 되도록 한 다음 이를 다시 사용될 제품의 바닥재 길이 및 폭이 되도록 별도로 마련된 절단톱에 의해 절단하는 상태로 하여 원재료비가 절감되도록 함과 함께 제조 완료된 바닥재를 제품에 이용한 상태에서 상기 제품을 사용할 경우 높은 습도에 의해서도 나무편이 변형되는 일이 없도록 한 것이다. 이를 위해 본 발명은, 원통형상의 원목을 회전시키면서 사용될 제품의 바닥재 두께보다 훨씬 얇은 두께가 되도록 절단칼에 의해 벗겨내어 목장판을 얻는 단계와, 상기 얇은 두께로 벗겨진 목장판의 둘레부분을 절단칼에 의해 절단하여 그 절단면이 일직선상태가 되게 하는 단계와, 상기 둘레부분이 일직선상태로 된 여러장의 목장판을 일정크기가 되도록 수평상태로 접촉시켜 그 접촉면을 합성수지본드에 의해 오버로크식으로 접착 연결하는 단계와, 상기 합성수지본드에 의해 연결된 넓은 크기의 목장판에 방수본드를 도포한 다음 전체 두께가 사용될 제품의 바닥재 두께가 되도록 여러장 적층하는 단계와, 상기 여러장 적층된 목장판을 열프레스에 의해 일체로 가압시켜 넓은 크기의 목판을 얻는 단계와, 상기 목판을 사용될 제품의 바닥재 길이 및 폭이 되도록 다시 절단톱에 의해 절단하여 나무편 몸체(101)를 얻는 단계와, 상기 나무편 몸체의 상부면을 센딩(sanding)처리하여 매끄럽게 하는 단계와, 상기 센딩처리된 나무편 몸체(101)의 상부면에 UV코팅제를 수회 도포하여 일정한 두께의 UV코팅층(102)을 형성하는 단계와, 상기 UV코팅층의 상부면에 우레탄도료를 도포하여 일정한 두께의 우레탄코팅층(103)을 형성하는 단계가 순차적으로 수행되어 제조된 바닥재용 나무편의 제조방법이다. |
---|---|
AbstractList | PURPOSE: A method for manufacturing of a wood board for flooring coverings is provided to reduce raw material cost and prevent deformation of the wood board due to moisture by differing manufacturing process of the wood board. CONSTITUTION: The method for manufacturing of a wood board for flooring coverings comprises the steps of obtaining wood flooring by stripping off wood from the material wood using a cutting knife as rotating a cylindrical material wood so that the stripped wood has a thickness far thinner than that of a product flooring to be used; cutting the circumferential part of the wood flooring stripped off to a thin thickness using the cutting knife so that the cutting surface is in the straight line state; adhering thus connecting the contact surfaces of the wood floorings using a synthetic resin bond by horizontally contacting a plurality of wood floorings the circumferential part of which is in the straight line state so that the wood floorings are horizontally contacted to a certain size; laying up several sheets of the wood floorings so that the total thickness of the bond coated wood flooring becomes thickness of the product flooring to be used after coating a waterproofing bond onto the large sized wood floorings connected by the synthetic resin bond; obtaining a large sized wood board by integrally pressing the laid-up several sheets of wood floorings using a hot press; obtaining the body(101) of the wood board by cutting the wood board again using a cutting saw so that the wood board has length and width of the product flooring to be used; smoothing the body of the wood board by sanding the upper surface of the body of the wood board; forming a UV coating layer(102) of a certain thickness by coating a UV coating agent onto the upper surface of the sanding treated body of the wood board for several times; and forming an urethane coating layer(103) of a certain thickness by coating an urethane paint on the upper surface of the UV coating layer.
본 발명은 바닥재용 나무편의 제조방법에 관한 것으로, 원통형상의 원목을 회전시키면서 절단칼에 의해 얇은 두께로 벗겨낸 다음 이를 넓게 연결시킴과 동시에 여러장을 적층상태로 접착제에 의해 접착시켜 원하는 두께가 되도록 한 다음 이를 다시 사용될 제품의 바닥재 길이 및 폭이 되도록 별도로 마련된 절단톱에 의해 절단하는 상태로 하여 원재료비가 절감되도록 함과 함께 제조 완료된 바닥재를 제품에 이용한 상태에서 상기 제품을 사용할 경우 높은 습도에 의해서도 나무편이 변형되는 일이 없도록 한 것이다. 이를 위해 본 발명은, 원통형상의 원목을 회전시키면서 사용될 제품의 바닥재 두께보다 훨씬 얇은 두께가 되도록 절단칼에 의해 벗겨내어 목장판을 얻는 단계와, 상기 얇은 두께로 벗겨진 목장판의 둘레부분을 절단칼에 의해 절단하여 그 절단면이 일직선상태가 되게 하는 단계와, 상기 둘레부분이 일직선상태로 된 여러장의 목장판을 일정크기가 되도록 수평상태로 접촉시켜 그 접촉면을 합성수지본드에 의해 오버로크식으로 접착 연결하는 단계와, 상기 합성수지본드에 의해 연결된 넓은 크기의 목장판에 방수본드를 도포한 다음 전체 두께가 사용될 제품의 바닥재 두께가 되도록 여러장 적층하는 단계와, 상기 여러장 적층된 목장판을 열프레스에 의해 일체로 가압시켜 넓은 크기의 목판을 얻는 단계와, 상기 목판을 사용될 제품의 바닥재 길이 및 폭이 되도록 다시 절단톱에 의해 절단하여 나무편 몸체(101)를 얻는 단계와, 상기 나무편 몸체의 상부면을 센딩(sanding)처리하여 매끄럽게 하는 단계와, 상기 센딩처리된 나무편 몸체(101)의 상부면에 UV코팅제를 수회 도포하여 일정한 두께의 UV코팅층(102)을 형성하는 단계와, 상기 UV코팅층의 상부면에 우레탄도료를 도포하여 일정한 두께의 우레탄코팅층(103)을 형성하는 단계가 순차적으로 수행되어 제조된 바닥재용 나무편의 제조방법이다. |
Author | MUN, SEUNG GYU |
Author_xml | – fullname: MUN, SEUNG GYU |
BookMark | eNrjYmDJy89L5WSwyE0tychPUUjLL1LITcwrTUtMLiktysxLV8hPU0jKTyyCSKXl5OeDRXMTS1KLMhNzinkYWNOAVCovlOZmUHZzDXH20E0tyI9PLS5ITE7NSy2J9w4yMjAwNjAwNDMwM3E0Jk4VAOL1MQc |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 바닥재용 나무편의 제조방법 |
Edition | 7 |
ExternalDocumentID | KR20030016064A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_KR20030016064A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:40:16 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English Korean |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_KR20030016064A3 |
Notes | Application Number: KR20010049977 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030226&DB=EPODOC&CC=KR&NR=20030016064A |
ParticipantIDs | epo_espacenet_KR20030016064A |
PublicationCentury | 2000 |
PublicationDate | 20030226 |
PublicationDateYYYYMMDD | 2003-02-26 |
PublicationDate_xml | – month: 02 year: 2003 text: 20030226 day: 26 |
PublicationDecade | 2000 |
PublicationYear | 2003 |
RelatedCompanies | IL JIN ART INDUSTRIAL CO., LTD |
RelatedCompanies_xml | – name: IL JIN ART INDUSTRIAL CO., LTD |
Score | 2.5508726 |
Snippet | PURPOSE: A method for manufacturing of a wood board for flooring coverings is provided to reduce raw material cost and prevent deformation of the wood board... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | NAILING OR STAPLING MACHINES IN GENERAL PERFORMING OPERATIONS TRANSPORTING WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL WORKING VENEER OR PLYWOOD |
Title | method for manufacturing of board for flooring materials |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030226&DB=EPODOC&locale=&CC=KR&NR=20030016064A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_mFPVNp-LHlILSt6Jb2rR5KOL6wXC4jTJlb6NNGxjOZrgO_32v6ap72lvIhZDkcrl8_H4XgAdCWGrZvIsa4I5hJnHHYAxPKZmwacxsQZ-4QlsMaf_dfJ1a0wYsai6MihP6o4IjokVxtPdCrdfL_0ssX2ErV4_JHLPkczhxfb0-HRN0SVT3e24wHvkjT_c8dxDpw6iSldHUqPmyB_u4kbZLAFjw0St5KcttpxKewMEY68uLU2h8yhYcefXfay04fNs8eWNyY32rM3Cq75413GdqX3G-LkkJimWoSaElEnWtRGIhFaoOyxTV_DqH-zCYeH0DmzD76_FsEG23l1xAM5d5dgkadwgxOctS9OxmN6VJR8SW4LxDUseiLLuC9q6arneLb-BYYdVKxjZtQ7P4Xme36HOL5E4N1S-LEoSw |
link.rule.ids | 230,309,783,888,25578,76884 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT4MwEL_MaZxvOjVTp5JoeFuUFQo8EOP4CMq-QtDsjUCBxDhhcSz--x5l0z3trek1l2uv1-vH_a4A94ToiaKyPmqAaT05jqSeruMpJc1UGulqRh8Zj7YYU_dNfp0pswbMN1gYnif0hydHRItiaO8lX68X_5dYFo-tXD7EH1hVPDmBYYmb0zFBl0RFa2DY04k1MUXTNDxfHPs1rcqmRuXnPdjHTbZWZdq33wcVLmWx7VScYziYIr-8PIHGZ9GGlrn5e60Nh6P1kzcW19a3PAWt_u5ZwH2m8BXlqwqUwFGGQpEJcYG65qRsXvCoOmxT1vPrDO4cOzDdHooQ_vU49Pxteck5NPMiTzsgMI0Qmelpgp5d7ic0lrJIyRiTSKIpVE8voLuL0-Vu8i203GA0DIcvY-8KjnjcWoXepl1olt-r9Br9bxnf8GH7BewQh6A |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=method+for+manufacturing+of+board+for+flooring+materials&rft.inventor=MUN%2C+SEUNG+GYU&rft.date=2003-02-26&rft.externalDBID=A&rft.externalDocID=KR20030016064A |