Sheet type resin for filling and preparing method of multilayer printed circuit board using the same
PURPOSE: A sheet type resin and a method for fabricating a multi-layered PCB(Printed Circuit Board) using the same are provided to form uniformly pressure within a cavity and prevent contamination due to adhesive resin by using filling resin. CONSTITUTION: A cushion pad(30) is used for transmitting...
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| Main Authors | , , |
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| Format | Patent |
| Language | English Korean |
| Published |
23.01.2003
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| Edition | 7 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | PURPOSE: A sheet type resin and a method for fabricating a multi-layered PCB(Printed Circuit Board) using the same are provided to form uniformly pressure within a cavity and prevent contamination due to adhesive resin by using filling resin. CONSTITUTION: A cushion pad(30) is used for transmitting uniformly pressure on a cavity. The first film(31) is formed with a fluoric polymer film having thermal resistance, chemical resistance, and abrasion resistance. The first film(31) has thickness of 100 to 200 micro meter. A thermoplastic filling resin(32) is formed with by adding a phenolic addition or a phosphite addition of 0.1 to 0.2 weight percent to a resin selected from a group including polyethylene, polypropylene, and polystyrene. The thermoplastic filling resin(32) has glass transition temperature of 120 to 130 degrees centigrade. The second film(31) is formed with the fluoric polymer film having thermal resistance, abrasion resistance, and chemical resistance. The second film(31) has thickness of 100 to 200 micro meter. A cover film(33) has the glass transition temperature of 280 to 300 degrees centigrade. The cover film(33) is formed with one or more elements selected from a fluoric ductile film group having thickness of 25 to 50 micro meter.
본 발명은 시트형태의 충진용 수지 및 이를 이용한 다층 인쇄회로기판의 제조방법에 관한 것으로, 적층면적이 다른 다수층의 기판을 동시에 적층시킬 때 압력을 균일하게 적용하기 위해 사용하는 시트형태의 충진용 수지 및 이를 이용한 다층 인쇄회로기판의 제조방법에 관한 것이다. 본 발명에 따른 충진용 수지를 이용하여 다층 인쇄회로기판을 제조할 경우, 캐비티내에 균일한 압력을 부여할 수 있어 박리화에 대한 신뢰성이 향상되고, 쿠션재료가 캐비티 내에 매립되기 때문에 프리프레그 등의 접착제가 캐비티 내부로 유출되는 것을 막을 수 있을 뿐만 아니라, 이로 인하여 수지에 의한 도체회로의 오염을 방지할 수 있고, 수지의 취급이 용이하며 적층후 충진용 수지의 해체도 용이하다. |
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| AbstractList | PURPOSE: A sheet type resin and a method for fabricating a multi-layered PCB(Printed Circuit Board) using the same are provided to form uniformly pressure within a cavity and prevent contamination due to adhesive resin by using filling resin. CONSTITUTION: A cushion pad(30) is used for transmitting uniformly pressure on a cavity. The first film(31) is formed with a fluoric polymer film having thermal resistance, chemical resistance, and abrasion resistance. The first film(31) has thickness of 100 to 200 micro meter. A thermoplastic filling resin(32) is formed with by adding a phenolic addition or a phosphite addition of 0.1 to 0.2 weight percent to a resin selected from a group including polyethylene, polypropylene, and polystyrene. The thermoplastic filling resin(32) has glass transition temperature of 120 to 130 degrees centigrade. The second film(31) is formed with the fluoric polymer film having thermal resistance, abrasion resistance, and chemical resistance. The second film(31) has thickness of 100 to 200 micro meter. A cover film(33) has the glass transition temperature of 280 to 300 degrees centigrade. The cover film(33) is formed with one or more elements selected from a fluoric ductile film group having thickness of 25 to 50 micro meter.
본 발명은 시트형태의 충진용 수지 및 이를 이용한 다층 인쇄회로기판의 제조방법에 관한 것으로, 적층면적이 다른 다수층의 기판을 동시에 적층시킬 때 압력을 균일하게 적용하기 위해 사용하는 시트형태의 충진용 수지 및 이를 이용한 다층 인쇄회로기판의 제조방법에 관한 것이다. 본 발명에 따른 충진용 수지를 이용하여 다층 인쇄회로기판을 제조할 경우, 캐비티내에 균일한 압력을 부여할 수 있어 박리화에 대한 신뢰성이 향상되고, 쿠션재료가 캐비티 내에 매립되기 때문에 프리프레그 등의 접착제가 캐비티 내부로 유출되는 것을 막을 수 있을 뿐만 아니라, 이로 인하여 수지에 의한 도체회로의 오염을 방지할 수 있고, 수지의 취급이 용이하며 적층후 충진용 수지의 해체도 용이하다. |
| Author | PARK, GEON YANG LEE, JON TAE KANG, JANG GYU |
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| Snippet | PURPOSE: A sheet type resin and a method for fabricating a multi-layered PCB(Printed Circuit Board) using the same are provided to form uniformly pressure... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Sheet type resin for filling and preparing method of multilayer printed circuit board using the same |
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