WIRING BOARD SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCTION OF WIRING BOARD

• Main Authors: CHINDA AKIRA, MATSUURA AKIRA
• Format: Patent
• Language: English; Korean
• Published: 26.06.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PURPOSE: A semiconductor device in which a semiconductor chip has been mounted on its wiring board can be thinned and a height extending from a mount board to the top surface of its semiconductor device can be reduced in the case when the semiconductor device wherein a semiconductor chip has been mounted on its wiring board is mounted on the mount board. CONSTITUTION: A wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening, which comprises the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed being thinner than that of the insulating substrate. 본 발명은, 개구가 필름형 절연성 기판의 소정 위치에 정의되고, 그 개구를 덮는 접속단자를 구비한 전기 배선이 절연성 기판의 주요 평면에 설치되고, 전기 배선의 접속단자와 접속되는 도전성 부재가 개구 내측에 설치되는 배선 기판에 있어서, 도전성 부재는, 절연성 기판의 전기 배선이 형성된 표면으로부터의 두께가 절연성 기판의 두께보다 얇은 것을 특징으로 한다.