semiconductor device

PURPOSE: A semiconductor device is provided to prevent an oxidation of a bit line by additionally forming an oxide layer on a stopping layer by in-situ. CONSTITUTION: A bit line(104) having a doped polysilicon(102a) and a tungsten silicide(102b) is formed on an active region of a semiconductor subst...

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Main Author BAEK, HONG JU
Format Patent
LanguageEnglish
Korean
Published 07.11.2001
Edition7
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Abstract PURPOSE: A semiconductor device is provided to prevent an oxidation of a bit line by additionally forming an oxide layer on a stopping layer by in-situ. CONSTITUTION: A bit line(104) having a doped polysilicon(102a) and a tungsten silicide(102b) is formed on an active region of a semiconductor substrate(100). A stopping layer(106) made of a nitride is formed on the resultant structure. An oxide layer(108) is formed on the entire surface of the stopping layer(106). On the oxide layer(108), an interlayer dielectric(110) planarized by a wet reflow process is formed. At this time, the oxide layer(108) is formed by in-situ after forming the stopping layer(106) made of a nitride. 비트 라인(bit line)의 산화를 방지할 수 있도록 설계된 반도체 소자가 개시된다. 이를 위하여 본 발명에서는, 비트 라인이 구비된 반도체 기판과, 상기 결과물 상에 형성된 질화막 재질의 스토핑막과, 상기 스토핑막 상에 형성된 산화막 및, 상기 산화막 상에 형성되며, 습식 리플로우 공정에 의해 평탄화된 층간 절연막으로 이루어진 반도체 소자가 제공된다. 그 결과, 층간 절연막의 습식 리플로우 공정 진행시 HPO가 발생하더라도 산화막을 이용하여 스토핑막이 제거되는 것을 막을 수 있게 되므로, 비트 라인의 산화를 방지할 수 있게 된다.
AbstractList PURPOSE: A semiconductor device is provided to prevent an oxidation of a bit line by additionally forming an oxide layer on a stopping layer by in-situ. CONSTITUTION: A bit line(104) having a doped polysilicon(102a) and a tungsten silicide(102b) is formed on an active region of a semiconductor substrate(100). A stopping layer(106) made of a nitride is formed on the resultant structure. An oxide layer(108) is formed on the entire surface of the stopping layer(106). On the oxide layer(108), an interlayer dielectric(110) planarized by a wet reflow process is formed. At this time, the oxide layer(108) is formed by in-situ after forming the stopping layer(106) made of a nitride. 비트 라인(bit line)의 산화를 방지할 수 있도록 설계된 반도체 소자가 개시된다. 이를 위하여 본 발명에서는, 비트 라인이 구비된 반도체 기판과, 상기 결과물 상에 형성된 질화막 재질의 스토핑막과, 상기 스토핑막 상에 형성된 산화막 및, 상기 산화막 상에 형성되며, 습식 리플로우 공정에 의해 평탄화된 층간 절연막으로 이루어진 반도체 소자가 제공된다. 그 결과, 층간 절연막의 습식 리플로우 공정 진행시 HPO가 발생하더라도 산화막을 이용하여 스토핑막이 제거되는 것을 막을 수 있게 되므로, 비트 라인의 산화를 방지할 수 있게 된다.
Author BAEK, HONG JU
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Snippet PURPOSE: A semiconductor device is provided to prevent an oxidation of a bit line by additionally forming an oxide layer on a stopping layer by in-situ....
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title semiconductor device
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