SEMICONDUCTOR DEVICE

PURPOSE: To provide a semiconductor device for increasing the influence of simultaneous switching noise or the like by increasing the decoupling capacitor between ground and power supply rings. CONSTITUTION: A ground ring 2 and a power supply ring 3 are formed around a semiconductor component 1 on a...

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Bibliographic Details
Main Authors KATO YOSHITHUGU, HOSOYAMADA SUMIKAZU, IKEMOTO YOSHIHIKO, ABE MITSUO
Format Patent
LanguageEnglish
Korean
Published 25.07.2001
Edition7
Subjects
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Summary:PURPOSE: To provide a semiconductor device for increasing the influence of simultaneous switching noise or the like by increasing the decoupling capacitor between ground and power supply rings. CONSTITUTION: A ground ring 2 and a power supply ring 3 are formed around a semiconductor component 1 on an interposer 6. A plurality of protrusions 3a protruding toward the ground ring 2 are provided at the power supply ring 3. The ground ring 2 is provided with a recess 2a for receiving the protrusions 3a at a predetermined distance. 본 발명은 접지 링과 전원 링 사이의 디커플링 용량을 증대시켜, 동시 스위칭 노이즈 등의 영향을 감소시킨 반도체장치를 제공하는 것을 목적으로 한다. 본 발명에서는, 인터포저(6) 상의 반도체 소자(1)의 주위에 접지 링(2) 및 전원 링(3)을 형성한다. 전원 링(3)에 접지 링(2)으로 향하여 돌출된 복수의 볼록부(3a)를 형성한다. 접지 링(2)에는 볼록부(3a)를 소정 거리 떨어진 상태에서 수용하는 오목부(2a)를 형성한다.
Bibliography:Application Number: KR20000050442