LEAD FRAME FOR MANUFACTURING SEMICONDUCTOR PACKAGE

PURPOSE: A lead frame for manufacturing a semiconductor package is provided to perform smoothly a molding process by forming sufficiently a space for floating a molding compound. CONSTITUTION: A multitude of outer lead(160) is extended to an inside of a frame body(100). A multitude of inner lead(130...

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Bibliographic Details
Main Author LEE, JIN AN
Format Patent
LanguageEnglish
Korean
Published 02.07.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A lead frame for manufacturing a semiconductor package is provided to perform smoothly a molding process by forming sufficiently a space for floating a molding compound. CONSTITUTION: A multitude of outer lead(160) is extended to an inside of a frame body(100). A multitude of inner lead(130) is extended to an inside of the outer leads(160). A lead lock tape(140) is adhered along an inner circumference of inside of the inner lead(130) in order to fix a position of the inner lead(130). A die pad(120) is located at a center portion of the inner lead(130). A semiconductor chip is loaded on an upper portion of the inner lead(130). A tie bar(110) is adhered to the lead lock tape(140) and connected with the die pad(120).
Bibliography:Application Number: KR19990054304