LEAD FRAME FOR SEMICONDUCTOR PACKAGE

PURPOSE: A lead frame for a semiconductor package having a heat sink is provided to reduce manufacturing processes and costs thereof by eliminating a conventional tie bar. CONSTITUTION: In the semiconductor package having the heat sink(16), a chip(20) is centrally attached onto the heat sink(16) by...

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Bibliographic Details
Main Author LEE, JIN AN
Format Patent
LanguageEnglish
Korean
Published 06.04.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A lead frame for a semiconductor package having a heat sink is provided to reduce manufacturing processes and costs thereof by eliminating a conventional tie bar. CONSTITUTION: In the semiconductor package having the heat sink(16), a chip(20) is centrally attached onto the heat sink(16) by an adhesive. Therefore, the conventional tie bar is not required for the lead frame(10a) used for this type package. The lead frame(10a) has a plurality of leads(18) peripherally attached onto the heat sink(16) by a double-faced adhesive tape. The leads(18) are disposed apart from four sides of the chip(20) and arranged radially. The leads(18) are supported by a lead lock tape(14) running across the respective leads(18), so that the leads(18) can lie in the same plane. In particular, a space where the tie bar is eliminated permits a molding compound resin to flow smoothly.
Bibliography:Application Number: KR19990037198