HYBRID MEMORY MODULE AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: A hybrid memory module and a manufacturing method thereof are provided to improve yields by reducing a connection failure due to foreign materials. CONSTITUTION: A component of a wafer state is mounted by connecting a bonding terminal formed on the upper side of a printed circuit board(500)...

Full description

Saved in:
Bibliographic Details
Main Authors CHUNG, SUNG WON, CHUNG, BYUNG MIN
Format Patent
LanguageEnglish
Korean
Published 25.03.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A hybrid memory module and a manufacturing method thereof are provided to improve yields by reducing a connection failure due to foreign materials. CONSTITUTION: A component of a wafer state is mounted by connecting a bonding terminal formed on the upper side of a printed circuit board(500) with the terminal of the component. A molding process is performed on the upper side of the printed circuit board which the component with the wafer state is mounted using a resin based material(520). One packaged component or more are mounted on the lower side of the printed circuit board using SMT(Surface Mounting Technology).
Bibliography:Application Number: KR20090031238