TRANSFERRING MEHTOD FOR FULL CUTTED SUBSTRATE

A method for transferring a cut substrate is provided to prevent the substrate from being scratched and broken by extracting the substrate after separating a substrate stage from an adjacent substrate stage. A method for transferring a cut substrate includes the steps of: installing a substrate with...

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Bibliographic Details
Main Authors ROH, YOUN GOO, JUNG, BYOUNG HYUN, JUNG, WON WOONG, LEE, JONG WOO
Format Patent
LanguageEnglish
Published 09.08.2007
Subjects
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
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Summary:A method for transferring a cut substrate is provided to prevent the substrate from being scratched and broken by extracting the substrate after separating a substrate stage from an adjacent substrate stage. A method for transferring a cut substrate includes the steps of: installing a substrate with a plurality of thin film transistors(261) on a first substrate stage(210) and a second substrate stage(220); cutting a substrate by a predetermined number; and moving at least one of the first substrate stage and the second substrate stage, separating the cut substrates and extracting the substrate. The first substrate stage(210) and the second substrate stage(220) are horizontally moved by each driving motor.
Bibliography:Application Number: KR20060020107