ADHESIVE IMPROVING AGENT OF THE POLYMER COMPOSITION SUBSTRATE AND POLYMER COMPOSITION COMPRISING IT

• Main Authors: SEO, YEON HO, JANG, HAI WOON, LEE, YOUNG KYONG, KIM, WAN OUK, JEONG, SANG OK
• Format: Patent
• Language: English
• Published: 25.01.2007
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

Provided is an adhesion enhancer based on a polymer blend, which enhances adhesion between a primer and a polymer substrate, maintains physical properties of a polymer in the polymer blend, and causes no drop in transparency or change in color. The adhesion enhancer based on a polymer blend is obtained by supporting an organic compound on a porous body and is for use in adhesion between a primer having an isocyanate group and a polymer substrate. The adhesion enhancer is obtained by supporting 130-300 parts by weight of an organic compound having a boiling point of 120 deg.C or higher and selected from an alcohol compound, phenol compound and organic compound having a hydroxyl group of the alcohol and phenol compounds and another functional group, onto 100 parts by weight of a porous body having a specific surface area of 100m^2 or more.