PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH ADHESIVE TAPE, LEAD FRAME WITH ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING LEAD FRAME

PURPOSE: An adhesive tape for semiconductor, a method of producing an adhesive tape-bearing lead frame using the same, an adhesive tape-bearing lead frame, and a semiconductor device fabricated by using the same are provided to improve work efficiency. CONSTITUTION: A semiconductor chip(7) is mounte...

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Main Authors IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, HOSOGAWA YOUICHI, YANAGISAWA SATORU, KIRIHARA HIROSHI
Format Patent
LanguageEnglish
Korean
Published 07.11.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract PURPOSE: An adhesive tape for semiconductor, a method of producing an adhesive tape-bearing lead frame using the same, an adhesive tape-bearing lead frame, and a semiconductor device fabricated by using the same are provided to improve work efficiency. CONSTITUTION: A semiconductor chip(7) is mounted on a lead frame(5) comprising inner leads(51), outer leads(52) and bus bars(53). The inner leads(51) are connected with the die pads of the semiconductor chip(7) by gold wires(8). The semiconductor device is molded with a sealing material(9). The semiconductor chip(7) is bonded to the lead frame(5) by an adhesive tape piece(6) by using an adhesive tape-bearing lead frame which consists of the lead frame and the adhesive tape piece(6) applied thereto.
AbstractList PURPOSE: An adhesive tape for semiconductor, a method of producing an adhesive tape-bearing lead frame using the same, an adhesive tape-bearing lead frame, and a semiconductor device fabricated by using the same are provided to improve work efficiency. CONSTITUTION: A semiconductor chip(7) is mounted on a lead frame(5) comprising inner leads(51), outer leads(52) and bus bars(53). The inner leads(51) are connected with the die pads of the semiconductor chip(7) by gold wires(8). The semiconductor device is molded with a sealing material(9). The semiconductor chip(7) is bonded to the lead frame(5) by an adhesive tape piece(6) by using an adhesive tape-bearing lead frame which consists of the lead frame and the adhesive tape piece(6) applied thereto.
Author NOMURA YOSHIHIRO
KIRIHARA HIROSHI
IIOKA SHINJI
YANAGISAWA SATORU
TANABE YOSHIYUKI
HOSOGAWA YOUICHI
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– fullname: YANAGISAWA SATORU
– fullname: KIRIHARA HIROSHI
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Snippet PURPOSE: An adhesive tape for semiconductor, a method of producing an adhesive tape-bearing lead frame using the same, an adhesive tape-bearing lead frame, and...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH ADHESIVE TAPE, LEAD FRAME WITH ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING LEAD FRAME
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