EPOXY RESIN COMPOSITION FOR THE ENCAPSULATION OF SEMICONDUCTOR DEVICE WITH HIGH CRACK RESISTANCE

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Bibliographic Details
Main Author NAM, TAE-YONG
Format Patent
LanguageEnglish
Published 15.05.1999
Edition6
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Online AccessGet full text

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Author NAM, TAE-YONG
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SubjectTerms CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Title EPOXY RESIN COMPOSITION FOR THE ENCAPSULATION OF SEMICONDUCTOR DEVICE WITH HIGH CRACK RESISTANCE
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