ION IMPLANTER

PURPOSE:To cope with a large sized substrate by a method wherein a substrate fixing part is made to have a size sufficient to fix a piece of a substrate having a maximum size, and when the substrate is scanned, the part is moved forward and backward in the direction approximately perpendicular to th...

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Bibliographic Details
Main Authors MIYOSHI NORIOMI, YAGI TORU
Format Patent
LanguageEnglish
Published 17.01.1989
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To cope with a large sized substrate by a method wherein a substrate fixing part is made to have a size sufficient to fix a piece of a substrate having a maximum size, and when the substrate is scanned, the part is moved forward and backward in the direction approximately perpendicular to the deflection plane of an ion beam. CONSTITUTION:An ion beam 2 passes through a main deflection part 31 and an beam angle correction part 32, and irradiates a substrate 15 fixed on a substrate fixing part 14. The fixing part 14 is driven forward and backward on a plane approximately perpendicular to the deflection plane of the beam 2 by a driving bar 13a, bellows 13b, and a linear motion driving mechanism 13c. The beam 2 is scanned over the substrate 15 and ions are implanted into it. The bellows 13b on the side of the mechanism 13c is airtightly covered by a shielding body 13d, and the inside of the bellows is kept vacuum. By this arrangement, large sized substrates can be dealt with comparatively small sized devices.
Bibliography:Application Number: JP19870167998