MANUFACTURE OF PRINTED WIRING BOARD

PURPOSE:To enable molding of a printed wiring board in a curved surface form easily with only a mold platen, by a method wherein after an airtight sheet has been held temporarily by spreading the airtight sheet over the base of the printed wiring board on a mold platen and exhausting air of the insi...

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Bibliographic Details
Main Author YAMAGUCHI CHIHIRO
Format Patent
LanguageEnglish
Published 06.01.1988
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Summary:PURPOSE:To enable molding of a printed wiring board in a curved surface form easily with only a mold platen, by a method wherein after an airtight sheet has been held temporarily by spreading the airtight sheet over the base of the printed wiring board on a mold platen and exhausting air of the inside of the airtight sheet, stretch forming of the said base is performed after the mold platen by applying high temperature and high pressure to the same within a pressure oven. CONSTITUTION:An air plate 4 having an exhaust groove is mounted on a flat mold platen 1 on which a base 5 for a wiring board is mounted. one more top plate 6 put upon the same is covered with an airtight sheet 7 and the corresponding part of the mold platen 1 to the said sheet 7 is stuck to the sheet 7 with an adhesive tape 8..This is held within a pressure oven 9, an exhaust pipe 2 is led outside of the pressure oven 9, air in the interior is evacuated through suction, high-temperature and high-pressure gas is pressed in forcibly through a gas pouring port 10, the base 5 for the board is heated and the said base 5 follows after the mold platen 1.
Bibliography:Application Number: JP19860145744