METHOD AND DEVICE FOR END POINT DETECTION

PURPOSE:To improve the accuracy for detecting an end point of etching by a method wherein, when dry etching is performed on a thin film formed on the surface of a semiconductor wafer to form a prescribed pattern, different wavelengths of emission spectrums emitted from the thin film are combined and...

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Bibliographic Details
Main Authors MAEJIMA HIROSHI, WAKIYAMA FUMITOSHI, SEKIGUCHI KOICHIRO, OKABE TSUTOMU, KAMIOKA TETSUYA, HANAJIMA SHUICHI
Format Patent
LanguageEnglish
Published 30.04.1987
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