METHOD AND DEVICE FOR END POINT DETECTION
PURPOSE:To improve the accuracy for detecting an end point of etching by a method wherein, when dry etching is performed on a thin film formed on the surface of a semiconductor wafer to form a prescribed pattern, different wavelengths of emission spectrums emitted from the thin film are combined and...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
30.04.1987
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Subjects | |
Online Access | Get full text |
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