MANUFACTURE OF RESIN-MOLDED ELECTRONIC PARTS

PURPOSE:To facilitate a removal of resin flash by providing miniature protruded resins, which are 0.5 times or more the thickness of leads and have a height within the interval between the leads, at the time of resin molding. CONSTITUTION:The protrusion parts 9 of a molding mold bottom force 7 are r...

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Bibliographic Details
Main Authors KOKUBU HIDEYA, NADAMURA AKIO, SAKAI RYUICHIRO
Format Patent
LanguageEnglish
Published 14.03.1987
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To facilitate a removal of resin flash by providing miniature protruded resins, which are 0.5 times or more the thickness of leads and have a height within the interval between the leads, at the time of resin molding. CONSTITUTION:The protrusion parts 9 of a molding mold bottom force 7 are respectively provided with a local protrusion 9a faced upward. By these protrusions, the sectional area of the neck between resin flashes 5 and a mold main body 1 becomes smaller. Then, the resin attachment quantity at the neck between the mold main body 1 and the resin flashes 5 is not continuously equalized, but is locally lessened. Hereby, the resin flashes 5 peeled from a lead frame 2 become easy to be easily separate d from the mold main body 1. As a result, the post-mechanical disposal manual work which has been hitherto conducted becomes unnecessary.
Bibliography:Application Number: JP19850197648