ALIGNMENT DEVICE

• Main Authors: AYADA NAOKI, KUROKI YOUICHI, HAMAZAKI FUMIYOSHI, MATSUMURA TAKASHI
• Format: Patent
• Language: English
• Published: 03.12.1985
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

PURPOSE:To enable to measure alignment of a wafer in a short time by a method wherein when the quantity of a slippage of position before a stage is driven is small, measurement for confirmation of the quantity of a slippage after the stage is driven is omitted. CONSTITUTION:A CPU17 reads set data of an objective precision input device 18 at the step 402. Then the alignment marks of a mask 1 and a wafer 2 are scanned according to a laser beam at the step 403, the fact that the acquired quantity of a slippage is in the range of objective precision or not is judged at the step 404, and when it is in the range thereof, the process is jumped at once to the step 407 to complete the alignment process. At this time, when the prescribed value is made to 0.5mum, for example, and objective precision of alignment is made to 0.2mum, for example, reconfirmation of the quantity of the slippage after a stage is driven is performed when the quantity of the slippage is 0.5mum or more, and remeasurement after the stage is driven is not performed when the quantity of the slippage is 0.2-0.5mum. Accordingly, high speed alignment can be attained.