HIGH-ENERGY RAY-CURABLE RESIN COMPOSITION

• Main Authors: NAKANISHI YUTAKA, FUKUTAKA EITAROU, OUGI HIROSHI
• Format: Patent
• Language: English
• Published: 28.10.1985
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

PURPOSE:The titled composition having excellent adhesiveness to polyethylene terephthalate, consisting essentially of a glycidyl (meth)acrylate derivative, polyester (meth)acrylate, and an organic solvent-soluble saturated polyester. CONSTITUTION:A high-energy ray-curable resin composition is prepared by mixing 50-90wt% glycidyl (meth)acrylate derivative of formula I (e.g., 2-hydroxy-3- phenyloxypropyl acrylate) and/or polyester (meth)acrylate of formula II (e.g., beta-hydroxyethyl-beta'-acryloyloxyethyl phthalate) with 10-50wt% organic solvent- soluble saturated polyester (MW of about 1,000-10,000). In the above formulae, R2 is a group of formula III, R6 and R7 are each a group of formula IV, R1, R4, R5, and R8 are each H or methyl, R3 is H or alkyl, n1 and n3 are each 1-5, n2 is 0-4, and n4 is 1-3.