EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE

PURPOSE:The titled composition having high moisture resistance and high corrosion resistance, prepared by adding an organic substance-adsorbing resin to a composition mainly consisting of an epoxy resin, a curing agent, and an inorganic filler. CONSTITUTION:0.5-30pts.wt. organic substance-adsorbing...

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Bibliographic Details
Main Authors KOBAYASHI MASAYUKI, ICHI MASATOSHI, ASAI SHINICHIROU
Format Patent
LanguageEnglish
Published 12.06.1985
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:The titled composition having high moisture resistance and high corrosion resistance, prepared by adding an organic substance-adsorbing resin to a composition mainly consisting of an epoxy resin, a curing agent, and an inorganic filler. CONSTITUTION:0.5-30pts.wt. organic substance-adsorbing resin (e.g., styrene/divinylbenzene copolymer) is added to 100pts.wt. composition obtained by mixing 100pts.wt. epoxy resin with a curing agent (e.g., phenol novolak resin), 150- 450pts.wt. inorganic filler (e.g., talc) and, optionally, a cure accelerator, flame retardant, pigment, surface-reinforcing agent, mold release, etc., and the resulting mixture is allowed to stand at 10 deg.C or below for 10 days or longer to allow the resin to adsorb free organic substances.
Bibliography:Application Number: JP19830213353