WIRE BONDING DEVICE

PURPOSE:To enable to perform high speed bonding by a method wherein an X-Y table is separated into an X table and a Y table. CONSTITUTION:To perform bonding work, a lead frame 9 loading works 16 according to work fixing parts 14, 14 and a work press board 15 are fixed to an X table 11 at first. When...

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Bibliographic Details
Main Authors SUEMATSU MUTSUMI, AOYANAGI KATSUHIKO
Format Patent
LanguageEnglish
Published 26.12.1984
Edition3
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To enable to perform high speed bonding by a method wherein an X-Y table is separated into an X table and a Y table. CONSTITUTION:To perform bonding work, a lead frame 9 loading works 16 according to work fixing parts 14, 14 and a work press board 15 are fixed to an X table 11 at first. When a tool arm 4 provided with a capillary 3 at the tip rocks in the vertical direction, a Y table 1 and the X table 11 are transferred synchronously to perform bonding being controlled according to a main control circuit. Moreover, when the works 16 and the frame 9 are to be conveyed, the table 11 is transferred to the prescribed position, and after the press board 15 and the fixing parts 14, 14 are transferred to the top direction, work feed boards 13, 13 are descended, and feed bars 13b, 13b are engaged with positioning holes provided in the frame 9. Then after the table 11 is transferred, the fixing parts 14, 14 and the press board 15 are descended, and the feed boards 13, 13 are transferred to the top direction to fix the frame 9.
Bibliography:Application Number: JP19830106162