MANUFACTURE OF RESIN SEALED TYPE SEMICONDUCTOR DEVICE

PURPOSE:To effectively remove thick resin burrs by removing resin burrs after generating cracks by applying impulsive pressure in the vicinity of sealed area. CONSTITUTION:At the time of supplying resin, the resin leaks from a small gap at the aligning area between the top force 7 and the bottom for...

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Bibliographic Details
Main Authors TATENO KENICHI, YOKOZAWA MASAMI
Format Patent
LanguageEnglish
Published 27.11.1984
Edition3
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To effectively remove thick resin burrs by removing resin burrs after generating cracks by applying impulsive pressure in the vicinity of sealed area. CONSTITUTION:At the time of supplying resin, the resin leaks from a small gap at the aligning area between the top force 7 and the bottom force 8. A metal segment 11 made of super-hard alloy is loaded to the resin burr in the direction indicated by the arrow mark A so that a load becomes 15kg and a pressure is applied through this metal segment 11. While the sealed structure is moved at a rate of 0.5-2.0sec/cm in the direction indicated by the arrow mark B, the end point of metal segment 11 is attached to the resin burr and a pressure is applied therefrom. Thereby, crack 13 is generated on the resin burr 10. Through repetion of such application of pressure, the burr 10 can be exfoliated more easily. Finally, resin burr can be removed easily and simply by also employing the blast method and brushing method concurrently.
Bibliography:Application Number: JP19830083047