MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To eliminate the forming process of silver plated layer on pad layer saving precious metal and simplifying manufacturing process by a method wherein after cleaning up the surface of bonding pad layer, a complex salt layer formed on the surface whereon a backside gold evaporated layer of semi...

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Bibliographic Details
Main Authors KATSURA TADASHI, SHIMANUKI MAKOTO
Format Patent
LanguageEnglish
Published 13.08.1984
Edition3
Subjects
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