MANUFACTURE OF SEMICONDUCTOR DEVICE
PURPOSE:To eliminate the forming process of silver plated layer on pad layer saving precious metal and simplifying manufacturing process by a method wherein after cleaning up the surface of bonding pad layer, a complex salt layer formed on the surface whereon a backside gold evaporated layer of semi...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
13.08.1984
|
Edition | 3 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!