RESIN COMPOSITION FOR MOLDING

• Main Authors: SHIMAMURA KATSUICHI, OOCHI HIROYASU, ITOU KATSUHIKO, TSUTSUMI TOSHIHIKO
• Format: Patent
• Language: English
• Published: 10.08.1983
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PURPOSE:The titled composition useful as electrical parts, etc., having improved heat resistance and molding and processing properties, obtained by blending polyphenylene sulfide resin with a specific aromatic polyester resin. CONSTITUTION:99.9-50wt% aromatic polyester comprising repeating units shown by the formulaI(carbonyls are in meta- or para-position to each other), a group shown by the formula II (O is in meta- or para-position with respect to SO2), and a group shown by the formula III (O is in meta- or para-position with respect to X; X is 1-10C bifunctional hydrocarbon, O, CO, S, SO, or SO2; a is 0 or 1; R1-R4 are H, 1-8C hydrocarbon, halogen, and are not H simultaneously when X is SO2 and a is 1; l, m and n are integer, and m/l=0.36-1.06; n/l=0.04-0.66; (m+n)/l=0.90-1.10; l+m+n=10-1,000), wherein the group shown by the formula II and the group shown by the formula III are not adjoining each other, is blended with 0.1-50wt% polyphenylene sulfide resin shown by the formula (Ph-S)n (Ph is a group shown by the formula IV, V, etc.) as a promotor for fluidization in molten state (usually at 250-400 deg.C).