PRODUCTION OF PREPREG

PURPOSE:To produce a pregreg free from measling an suitable as a material for printed bases, by impregnating a reinforcing sheet with a varnish prepared by adding dicyandiamide in an amount less than equivalent to epoxy resin to an epoxy resin component, and heating the impregnated sheet. CONSTITUTI...

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Bibliographic Details
Main Authors BANDAI SHIGEKI, NISHIZUKA MAKOTO
Format Patent
LanguageEnglish
Published 21.07.1983
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:PURPOSE:To produce a pregreg free from measling an suitable as a material for printed bases, by impregnating a reinforcing sheet with a varnish prepared by adding dicyandiamide in an amount less than equivalent to epoxy resin to an epoxy resin component, and heating the impregnated sheet. CONSTITUTION:In a process for producing a prepreg comprising impregnating a reinforcing sheet such as glass fiber cloth or paper with a varnish prepared by mixing (A) a resin component comprising (a) 40-95wt% polyepoxy compound and (b) 60-5wt% polyphenol with (B) a dicyandiamide curing agent, (C) a cure accelerator and (D) an organic solvent, heating the impregnated sheet and thereby removing the organic solvent and at the same time reacting compounds (a) and (b) with each other; said varnish comprises 100pts.wt. component A, 0.05- 3pts.wt. component C and 15-150pts.wt. solvent D and component B is used in such an amount that the ratio of the number of active hydrogens to the number R (calculated from the equation) of epoxy groups is 1.35-30.
Bibliography:Application Number: JP19820006510