DIAMOND WIRE SAW

• Main Author: KOIWA MASAHIRO
• Format: Patent
• Language: English
• Published: 02.03.1999
• Edition: 6
• Subjects: BROACHING; FILING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PLANING; SAWING; SCRAPING; SHEARING; SLOTTING; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To provide a smooth cut surface and the correct perpendicularity of the cut surface without damaging the machinability by main beads. SOLUTION: This diamond wire saw comprises a metallic stranded wire 6; main beads 7 fixed to the wire 6 with the prescribed intervals; and spacers 11 which are formed around the wire 6 between the main beads 7, protect the wire 6, and prevent the movement of the main beads 7. The main bead 7 comprises a cylindrical pedestal 8 fixed around the wire 6, and a cutting abrasive grain layer 9 formed around the pedestal 8. At least one cylindrical auxiliary bead 10 with the outside diameter same as that of the main bead 7 and having the cut surface grinding function and the wire vibration preventing function is provided at the position away from an end part of the main bead 7 by the length L1 of the main bead 7 so as to satisfy the inequality of L1 +L2 + L3 ...+Ln <=2L1 , where L1 , L2 , L3 ...Ln are the length of the auxiliary beads 10.