HEAT DISSIPATING SPACER

• Main Authors: IKEDA KAZUYOSHI, SAWA HIROAKI
• Format: Patent
• Language: English
• Published: 05.11.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a heat dissipating spacer having high flexibility and high thermal conductivity. SOLUTION: A heat dissipating spacer contains 40 to 60 vol.% thermally conductive filler, in which a volume ratio of zinc oxide powder of 0.3 to 1 μm in average grain diameter to oxide po...