HEAT DISSIPATING SPACER

PROBLEM TO BE SOLVED: To provide a heat dissipating spacer having high flexibility and high thermal conductivity. SOLUTION: A heat dissipating spacer contains 40 to 60 vol.% thermally conductive filler, in which a volume ratio of zinc oxide powder of 0.3 to 1 μm in average grain diameter to oxide po...

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Bibliographic Details
Main Authors IKEDA KAZUYOSHI, SAWA HIROAKI
Format Patent
LanguageEnglish
Published 05.11.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a heat dissipating spacer having high flexibility and high thermal conductivity. SOLUTION: A heat dissipating spacer contains 40 to 60 vol.% thermally conductive filler, in which a volume ratio of zinc oxide powder of 0.3 to 1 μm in average grain diameter to oxide powder of alumina and/or magnesia powder of 10 to 50 μm in average grain diameter is (0.5:9.5) to (3:7), and 60 to 40 vol.% addition polymerization-type liquid silicone solid matter, having 2 W/m.K or above thermal conductivity, and Asker C hardness of 50 or below.
Bibliography:Application Number: JP19980107283