INSPECTING DEVICE OF SUBSTRATE WITH BUMP

• Main Authors: NAGASAKI MASATO, TSUNEKAWA TOMOYOSHI
• Format: Patent
• Language: English
• Published: 19.10.1999
• Edition: 6
• Subjects: MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; TESTING

PROBLEM TO BE SOLVED: To precisely provide a piece of information such as height level distribution of bump apex, warpage or waviness of substrate surface or the like by generating a piece of inspection information reflecting the forming state of each bump on an inspecting surface on the basis of the information related to the height in each position within the inspecting surface, and mapping output the height distribution on the inspecting surface on a display device. SOLUTION: The incident light from a semiconductor laser beam source 12 is incident on an inspecting surface through a polygon mirror, reflected thereby and detected by a semiconductor position detector (PSD) 22. A height and luminance detecting part 75 calculates the height and luminance from the output of the PSD 22 and outputs the result to a central control unit 52. A CPU 56 generates the height information within the inspecting surface and transmits this information to the CPU 86 of a computer 82, which then generates the inspection information reflecting the forming state of each bump on the inspecting surface and transmits it to a monitor 98 and a printer 102. For these pieces of inspection information, the height range is divided by one or a plurality of thresholds, and the height distribution on the inspecting surface is mapping displayed according to the gray levels or colors of the picture elements corresponding to each divided range.