DEVICE AND METHOD FOR INSPECTING BUMPY BOARD AND MANUFACTURE OF BUMPY BOARD

• Main Authors: NAGASAKI MASATO, TSUNEKAWA TOMOYOSHI, ODAGIRI AKIRA, MATSUBARA YOICHI
• Format: Patent
• Language: English
• Published: 19.10.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TESTING

PROBLEM TO BE SOLVED: To provide an inspection device which can accurately identify a plurality of bumps formed on a board and can accurately and rapidly inspect the board on which, e.g. flat bumps are formed. SOLUTION: This inspection device applies an inspection light beam to an inspection surface of a bumpy board on which bumps are aligned, and as the light beam reflected is received by a PSD(semiconductor position detector), the device scans the inspection light beam two- dimensionally within the inspection surface. Information about the height value of each position within the inspection surface and information about the brightness of the reflected light beam are generated in accordance with the detection output of a light receiving part. Areas where the brightness of the reflected light beam equal to or greater than a threshold can be obtained are specified as high-brightness areas BA1-BA6, etc., and of the high brightness area specified, only the areas (BA1-BA3) each having a spread of a reference area SO or more are identified as required bump part areas wherein the required parts of the bumps are present. The height of each bump is calculated on the basis of the information about the height value of each position within the required bump part areas identified. Thus, even if the high brightness area derived from one of the bumps is split into two or more under the influence of the surface conditions of the bumps, etc., the trouble of mistaking the area for two or more bumps is unlikely cased.